MIL-STD-1310 Shipboard Bonding, Grounding, And Other Techniques For Electromagnetic Compatibility, Electromagnetic Pulse Emp Mitigation, And SafetyThis document specifies standard practices to facilitate achievement of the intra-ship and inter-ship electromagnetic compatibility EMC, electromagnetic pulse EMP, bonding, and intermodulation interference IMI requirements of MIL-STD-464.

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MIL-STD-1310H(NAVY)

CONTENTS
PARAGRAPH	PAGE
1. SCOPE......................................................................................................................................................................1
1.1 Scope.................................................................................................................................................................1
1.2 Application........................................................................................................................................................1
1.3 Tailoring............................................................................................................................................................1
1.4 New materials and technology..........................................................................................................................1
2. APPLICABLE DOCUMENTS ................................................................................................................................1
2.1 General..............................................................................................................................................................1
2.2 Government documents ....................................................................................................................................1
2.2.1 Specifications, standards, and handbooks ................................................................................................1
2.2.2 Other Government documents, drawings, and publications.....................................................................2
2.3 Non-Government publications..........................................................................................................................3
2.4 Order of precedence..........................................................................................................................................3
3. ACRONYMS and DEFINITIONS ...........................................................................................................................3
3.1 Acronyms used in this standard ........................................................................................................................3
3.2 Below deck areas ..............................................................................................................................................4
3.3 Bond-bonding (electrical) .................................................................................................................................4
3.4 Bond classification............................................................................................................................................4
3.5 Bond strap.........................................................................................................................................................4
3.5.1 Type V bond strap....................................................................................................................................4
3.6 Bright metal ......................................................................................................................................................4
3.7 Broadband noise (BBN)....................................................................................................................................5
3.8 Commercial-off-the-shelf (COTS)....................................................................................................................5
3.9 Computer ground system ..................................................................................................................................5
3.10 Conduit............................................................................................................................................................5
3.11 Electrical surge suppressor, marine type.........................................................................................................5
3.12 Electromagnetic compatibility (EMC)............................................................................................................5
3.13 Electromagnetic environment (EME) .............................................................................................................5
3.14 Electromagnetic interference (EMI) ...............................................................................................................5
3.15 Electromagnetic pulse (EMP) .........................................................................................................................5
3.16 Ground (ground potential) ..............................................................................................................................5
3.19 Ground loop ....................................................................................................................................................5
3.20 Ground, personnel/electrical safety.................................................................................................................5
3.21 Ground, radio frequency (RF).........................................................................................................................6
3.22 Ground, 360 degrees (peripheral) ...................................................................................................................6
3.17 Grounding .......................................................................................................................................................5
3.18 Grounding effectiveness .................................................................................................................................5
3.23 Intermodulation interference (IMI).................................................................................................................6
3.24 Maintenance-related EMI ...............................................................................................................................6
3.25 Mobile-transportable electrical equipment......................................................................................................6
3.27 Nonlinear junction ..........................................................................................................................................6
3.26 Non-developmental item (NDI)......................................................................................................................6
3.28 Portable equipment .........................................................................................................................................6
3.29 Shield ..............................................................................................................................................................6
3.30 Shielded area...................................................................................................................................................6
3.31 Terminal protection device (TPD) ..................................................................................................................6

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