MIL-STD-1310H(NAVY)
3.32 Topside areas ..................................................................................................................................................6
3.33 Trunk, wireway...............................................................................................................................................7
4. GENERAL REQUIREMENTS................................................................................................................................7
4.1 Ground potential and ships ground plane..........................................................................................................7
4.2 Class B and/or C bonding .................................................................................................................................7
4.3 EMP effects.......................................................................................................................................................7
4.4 Electrical safety.................................................................................................................................................7
4.5 Bonding and grounding of composite structures...............................................................................................7
4.6 Introduction of new technology ........................................................................................................................7
4.7 Quality assurance inspection.............................................................................................................................7
5. DETAILED REQUIREMENTS...............................................................................................................................7
5.1 Ground potential and ship's ground plane(s) ....................................................................................................7
5.1.1 Ground potential.......................................................................................................................................7
5.1.1.1 Ground potential for metallic hull ships ..........................................................................................7
5.1.1.2 Ground potential for nonmetallic hull ships ....................................................................................7
5.1.2 Ground plane(s)........................................................................................................................................7
5.1.2.1 Elements of the ground plane ..........................................................................................................8
5.1.2.1.1 Superstructure, equipment foundations and racks...................................................................8
5.1.2.1.2 Cable grounding system's branches........................................................................................8
5.1.2.1.3 Shielded room(s).....................................................................................................................8
5.1.2.1.4 Computer ground system ........................................................................................................8
5.1.2.2 Grounded items ...............................................................................................................................8
5.1.2.2.1 Equipment cabinets and hardware items.................................................................................8
5.1.2.2.2 Shock-mounted .......................................................................................................................8
5.1.2.2.3 Large/long hardware items .....................................................................................................8
5.1.2.2.4 Bond strap and grounding wire routing ..................................................................................8
5.1.2.2.5 Joiner/false/honeycomb bulkhead mounted equipment ..........................................................8
5.1.3 Class B and class C bonding and grounding preparations........................................................................8
5.1.3.1 Class B and C bond installation.......................................................................................................8
5.1.3.2 Hardware for class B and C bonding...............................................................................................9
5.1.3.3 Class C bonding/bond straps ...........................................................................................................9
5.1.3.3.1 Type I bond strap ..................................................................................................................10
5.1.3.3.2 Type II bond strap.................................................................................................................10
5.1.3.3.3 Type III bond strap ...............................................................................................................10
5.1.3.3.4 Type IV bond strap ...............................................................................................................10
5.1.3.3.5 Type V bond strap.................................................................................................................10
5.1.3.3.6 Bond strap attachment methods ............................................................................................10
5.1.4 Submarine equipment grounding ...........................................................................................................10
5.2 Hull-generated EMI prevention ......................................................................................................................10
5.2.1 Nonmetallic topside material..................................................................................................................10
5.2.2 Topside stowage.....................................................................................................................................11
5.2.2.1 Portable and removable metallic deck hardware ...........................................................................11
5.2.2.2 Other metallic material ..................................................................................................................11
5.2.3 Insulate topside metal-to-metal contact junctions ..................................................................................11
5.2.4 Bond topside metal-to-metal contact junctions ......................................................................................11
5.3 Cable and hull penetration EMI control..........................................................................................................11
5.3.1 Topside cable installations .....................................................................................................................11
5.3.1.1 Shielded cable................................................................................................................................11
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