MIL-STD-1310H(NAVY) APPENDIX A
GENERAL GUIDANCE A.1 SCOPE A.1.1 Scope. This appendix contains guidance concerning electromagnetic interference control. This Appendix is not a mandatory part of the standard. The information contained herein is intended for guidance only. A.2 APPLICABLE DOCUMENTS A.2.1 General. The documents listed in this section are specified in sections 3 or 4 of this appendix. This section does not include documents cited in other sections of this standard or recommended for additional information or as examples. While every effort has been made to ensure the completeness of this list, document users are cautioned that they must meet all specified requirements of documents cited in sections 3 or 4 of this appendix, whether or not they are listed. A.2.2 Government documents. A.2.2.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a part of this document to the extent specified therein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-461 - Interface Standard, Requirements for the Control of Electromagnetic Interference Characteristics of Subsystems and Equipment (Copies of these documents are available online at https://assist.daps.dla.mil/quicksearch/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) A.2.3 Order of precedence. Unless otherwise noted herein or in the contract, in the event of a conflict between the text of this document and the references cited herein, the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. A.3 INSTALLATION GUIDANCE A.3.1 Class B and class C bonding. Class B bonding, and almost invariably Class C bonding, involves establishing and maintaining an electrically conductive, minimum resistance/impedance path between metallic surfaces by bolting them together. The only distinction of significance between Class B and C bonding is that Class C always involves a bond strap where, in almost every case, both ends/lugs of the bond strap are to be bolted. A.3.2 Hull-generated EMI. Hull-generated EMI is caused by nonlinear or intermittent metal-to-metal contact junctions in the topside EME. It is advantageous to make the ship's topside areas, as nearly as possible, a single conducting surface free of all pinned, snap-linked, chain-linked, or other metallic discontinuities that might act as source(s) of IMI and BBN. Implementation of the following hull-generated EMI control measures can reduce IMI and BBN: a. Metal-to-metal contact junctions in the topside EME should be avoided by use of nonmetallic substitute when available. b. Metal-to-metal contact junctions, where movability or removability is not a requirement, should be Class A bonded. c. Metal-to-metal contact junctions, where movability or removability is a requirement, should be Class B or Class C bonded to provide a low impedance current path around the junction. d. The joining of dissimilar metals by bolting or riveting should be avoided in topside areas. e. Except for anchor and anchor holding, metal chain should not be installed in topside areas. f. Loose metallic items, such as pipes, cables, and portable rigging should not be stowed, stacked, or lashed down in topside areas. |
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