MIL-STD-1310 Shipboard Bonding, Grounding, And Other Techniques For Electromagnetic Compatibility, Electromagnetic Pulse Emp Mitigation, And SafetyThis document specifies standard practices to facilitate achievement of the intra-ship and inter-ship electromagnetic compatibility EMC, electromagnetic pulse EMP, bonding, and intermodulation interference IMI requirements of MIL-STD-464.

Pages 1 - 2 - 3 - 4 - 5 - 6 - 7 - 8 - 9 - 10 - 11 - 12 - 13 - 14 - 15 - 16 - 17 - 18 - 19 - 20 - 21 - 22 - 23 - 24 - 25 - 26 - 27 - 28 - 29 - 30 - 31 - 32 - 33 - 34 - 35 - 36 - 37 - 38 - 39 - 40 - 41 - 42 - 43 - 44 - 45 - 46

MIL-STD-1310H(NAVY)

g.    Bond strap will not restrict the movement of any hinged or pinned item and installation of bond strap will not place the bond strap in a binding or restrictive position that will lead to early breakage of the strap.

h.    Bond straps and non-metallic items located in topside areas are fabricated, installed, and treated as specified herein to prevent deterioration through corrosion, oxidation or weathering.

6.3.2  Final inspection.  Conducted after completion of all required installations to determine that all requirements specified for the particular ship involved have been accomplished and that the quality assurance provisions of 6.3 have been met.

6.3.3  Inspection responsibility.  Unless otherwise required by the contract, the contractor is responsible for performing the inspections.

6.3.4  Inspector certification.  The contractor is to certify that the inspector is qualified to perform the inspections specified herein.

6.3.5  Government verification.  All requirements specified by this standard are subject to government verification at any time.

6.4  RF impedance measurement.  A Type I bond strap will provide less than 25 ohms impedance at 30

MHz.  There is no need to perform routine RF impedance measurements on every bond for acceptance; routine measurement to demonstrate the RF impedance of any individual bond during the acceptance process should never be necessary.  However, in the event any system's performance is erratic during operational or acceptance

testing and problem indications are symptomatic of poor electrical grounding, this measurement specification is

included to help pinpoint or eliminate grounding as the cause.

6.5  Subject term (key word) listing. Broadband noise (BBN)

Cable ground system

Intermodulation interference (IMI) Junction, nonlinear

Penetration Weatherproofing Wireway trunks

6.6  Changes from previous issue.  Marginal notations are not used in this revision to identify changes with respect to the previous issue due to the extensiveness of the changes.

16