MIL-STD-1310 Shipboard Bonding, Grounding, And Other Techniques For Electromagnetic Compatibility, Electromagnetic Pulse Emp Mitigation, And SafetyThis document specifies standard practices to facilitate achievement of the intra-ship and inter-ship electromagnetic compatibility EMC, electromagnetic pulse EMP, bonding, and intermodulation interference IMI requirements of MIL-STD-464.

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MIL-STD-1310H(NAVY)

(Copies of these documents are available from the Naval Logistics Library, 5450 Carlisle Pike, Mechanicsburg, PA  17055 or online at https://nll.ahf.nmci.navy.mil.)

2.3  Non-Government publications.  The following documents form a part of this document to the extent specified herein.  Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract.

AMERICAN NATIONAL STANDARDS INSTITUTE (ANSI)

ANSI/IEEE C63.14     -          Dictionary of Electromagnetic Compatibility (EMC) including

Electromagnetic Environmental Effects (E3)

(Copies of this document are available from the American National Standards Institute, 25 W. 43rd St, 4th

Floor, New York, NY  10036 or online at https://webstore.ansi.org/.)

SAE INTERNATIONAL

SAE-AS85049             -          Connector Accessories, Electrical, General Specification for

(Copies of this document are available from SAE World Headquarters, 400 Commonwealth Drive, Warrendale, PA  15096-0001 or online at www.sae.org.)

2.4  Order of precedence.  Unless otherwise noted herein or in the contract, in the event of a conflict between the text of this document and the references cited herein, the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained.

3.  ACRONYMS and DEFINITIONS

The terms used that are not unique to this document are defined in ANSI Standard C63.14, Joint Pub 1-02, MIL-STD-464, and MIL-HDBK-237.  The following acronyms and definitions are included herein for ready reference and are applicable for the purpose of this standard.

3.1  Acronyms used in this standard.  The acronyms used in this standard are defined as follows: AGC        -        Automatic Gain Control

AVC        -        Automatic Volume Control

BBN         -        Broadband Noise

C5ISR      -        Command and Control, Communications, Computers, Combat Systems, Intelligence

Surveillance and Reconnaissance

COTS       -        Commercial-off-the-Shelf CRES       -        Corrosion-Resistant Steel DC           -        Direct Current

E3            -        Electromagnetic Environmental Effects

EM           -        Electromagnetic

EMC        -        Electromagnetic Compatibility EME        -        Electromagnetic Environment EMI         -        Electromagnetic Interference EMP         -        Electromagnetic Pulse

HF            -        High Frequency

ICD          -        Installation Control Drawing

IEMC       -        Industrial Electromagnetic Compatibility

IMI           -        Intermodulation Interference

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