MIL-STD-1310H(NAVY)
5.1.2.1 Elements of the ground plane. The following shall be bonded to ground potential to form elements of the ground plane.
5.1.2.1.1 Superstructure, equipment foundations and racks. Metallic superstructure, equipment foundations and racks, and mounting studs or brackets to which equipment is bolted for installation shall be bonded to the ground plane in accordance with the requirements of a Class A bond.
5.1.2.1.2 Cable grounding system's branches. Cable grounding system's branches and branch extensions connected to or terminating at the ground cable(s) of a nonmetallic hull ship's ground plane shall be Class A bonded.
5.1.2.1.3 Shielded room(s). Shielded room(s) on nonmetallic hull ships shall be bonded in accordance with the requirements of a Class A bond to the cable ground plane.
5.1.2.1.4 Computer ground system. Computer ground systems shall be installed in accordance with applicable computer system installation control drawings.
5.1.2.2 Grounded items. Equipment and hardware that is Class B or Class C bonded to the ship's ground plane shall be designated as grounded, but not as an element of the ground plane for grounding other items.
5.1.2.2.1 Equipment cabinets and hardware items. Electrical and electronic equipment cases, cabinets, racks, or enclosures that may require routine removal for repair and replacement during the ship's life cycle shall be Class B or Class C bonded to ground.
5.1.2.2.2 Shock-mounted. Shock-mounted equipment and equipment racks shall be Class C bonded to ground. Equipment mounted within equipment racks shall be grounded by a conductor within the cable harness.
5.1.2.2.3 Large/long hardware items. Unless insulated to prevent metal-to-metal contact in accordance with 5.2.3 below, topside metallic hardware items with any physical dimension greater than 10 feet shall be Class B or Class C bonded to ground.
5.1.2.2.4 Bond strap and grounding wire routing. All bond straps and grounding wires bonded to the ground plane shall be directly routed and as short as practical. Only one bond strap shall be connected to each stud or boss.
5.1.2.2.5 Joiner/false/honeycomb bulkhead mounted equipment. All electrical equipment mounted on a joiner/false/honeycomb bulkhead must have a separate green ground wire, or conductor identified with a wire label/tag as the ground wire, which connects to ship's ground plane. The current carrying capacity of the ground wire/conductor shall be equal or greater than the source conductor.
5.1.3 Class B and class C bonding and grounding preparations.
5.1.3.1 Class B and C bond installation. The following procedures shall be used to ensure effective Class
B and Class C bonds.
a. Antenna tuners and couplers. HF antenna tuners and couplers shall be bonded as shown in figure 10. b. Class B bonding procedure. At least one mounting bolt hole/mounting foot shall be prepared for
electrical safety. All mounting feet/mating surfaces shall be prepared for C5ISR equipment operation and
EMI/EMP mitigation bonding (see 4.2).
(1) Clean mating surfaces (e.g., sand, file, grind, brush, scrape, etc.) down to smooth, bright metal of item to be mounted. Use care not to gouge deep pits or grooves in the mating surfaces. Clean the contact surface(s) on the mounting area (ground plane) approximately ΒΌ inch larger than the mounting foot such that complete bright-metal contact is achieved when they are mated.
(2) Wipe down all surfaces to be mated with MIL-C-81302 non-residue type cleaning solvent to ensure they are clean and free of paint chips, metal filings and other residue.
8
For Parts Inquires call Parts Hangar, Inc (727) 493-0744
© Copyright 2015 Integrated Publishing, Inc.
A Service Disabled Veteran Owned Small Business