MIL-STD-1310 Shipboard Bonding, Grounding, And Other Techniques For Electromagnetic Compatibility, Electromagnetic Pulse Emp Mitigation, And SafetyThis document specifies standard practices to facilitate achievement of the intra-ship and inter-ship electromagnetic compatibility EMC, electromagnetic pulse EMP, bonding, and intermodulation interference IMI requirements of MIL-STD-464.

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TOP FLANGE PLATE (2)

WEB PLATE ASSY (2)

1

BOTTOM FLANGE PLATE

1

VIEW A-A                                                           VIEW C-C

B

NOTES:

1.                   THE CONDUCTIVE ELEMENT OF THE GASKET SHALL BE CRES OR

COPPER -NICKEL WIRE FIBERS PROVIDING CONDUCTIVITY ACROSS THE THICKNESS DIMENSION.  THE STABILIZING AND SEALING ELEMENT

OF THE GASKET SHALL BE EITHER CONDUCTIVE OR FABRICATED SUCH THAT IT DOES NOT PREVENT ELECTRICAL CONTACT BETWEEN MATING SURFACES.  IT MUST SEAL AND PRESERVE THE JUNCTION  TO PREVENT CORROSION.

2.        THE MOUNTING SURFACES IN CONTACT WITH THE GASKET SHALL BE CLEANED TO BRIGHT METAL AND COATED WITH CONDUCTIVE PAINT, A-A-59313 ANTISEIZE COMPOUND OR OTHER SURFACE PRESERVA- TIVE PROIR TO INSTALLATION OF THE GASKET.

3.        SPLIT-SLEEVE INSTALLATION SHOWN IS AS DETAILED IN THE NAVY INSTALLATION AND MAINTENANCE BOOK (NIMB) CD-ROM EDITION NSN

0910-LP-003-9770.

A                                    A

1

BOTTOM FLANGE PLATE

WAVEGUIDE

DECK/BHD SLEEVE

DECK END

C                                    C

B                             VIEW B-B

FIGURE 8.  Waveguides grounding.

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