MIL-STD-1310 Shipboard Bonding, Grounding, And Other Techniques For Electromagnetic Compatibility, Electromagnetic Pulse Emp Mitigation, And SafetyThis document specifies standard practices to facilitate achievement of the intra-ship and inter-ship electromagnetic compatibility EMC, electromagnetic pulse EMP, bonding, and intermodulation interference IMI requirements of MIL-STD-464.

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MIL-STD-1310H(NAVY) APPENDIX C

C.5 GROUNDING TO SHIELDED AREA

Items and equipments specified in C.4.1 above located within 6 inches of a shielded area shall be grounded to the shielded area or to any ground cable from the shielded area connection point. Class B bonding to the shielded area may be used in lieu of a cable ground connection.

C.6 CONNECTIONS

Equipment and items required to be grounded shall have ground connections for terminating the ground cables in accordance with figure C-2. Each electrical or electronic equipment shall be individually connected to a branch ground (or main ground) cable so that disconnecting one equipment ground will not cause loss of a ground connection to other equipment. Connections within the ground cable system shall provide the same low resistance as the ground cables. Prior to assembly, threaded and crimp connectors shall be coated with an antiseize compound in accordance with MIL-PRF-907. Connections shall be protected from corrosion by an application of Permatex Form-A-Gasket #2 (CAGE 01232; NSN 8030-00-849-0071) or equivalent non-acidic sealing compound.