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MIL-STD-1310 Shipboard Bonding, Grounding, And Other Techniques For Electromagnetic Compatibility, Electromagnetic Pulse Emp Mitigation, And SafetyThis document specifies standard practices to facilitate achievement of the intra-ship and inter-ship electromagnetic compatibility EMC, electromagnetic pulse EMP, bonding, and intermodulation interference IMI requirements of MIL-STD-464.

Pages 1 - 2 - 3 - 4 - 5 - 6 - 7 - 8 - 9 - 10 - 11 - 12 - 13 - 14 - 15 - 16 - 17 - 18 - 19 - 20 - 21 - 22 - 23 - 24 - 25 - 26 - 27 - 28 - 29 - 30 - 31 - 32 - 33 - 34 - 35 - 36 - 37 - 38 - 39 - 40 - 41 - 42 - 43 - 44 - 45 - 46



LIST OF MATERIAL


ITEM NO.


PART


SPECIFICATION


NOTE

1

BOND STRAP, TYPE V


2

2

STUD, COLLAR

MIL - S -24149

1


3


CLAMP, HOSE


A-A-52506


4

TUBING, PVC

MIL - I -631


4


NOTES:


3                                                                           FLEXIBLE CONDUIT


UNTERMINATED END OF BOND STRAP


4


STUD OR EXISTING BOLT

1

2

GROUND POTENTIAL


FIGURE 9.  Method of grounding flexible  metal conduit for below decks cable installations.



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