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MIL-STD-1310 Shipboard Bonding, Grounding, And Other Techniques For Electromagnetic Compatibility, Electromagnetic Pulse Emp Mitigation, And SafetyThis document specifies standard practices to facilitate achievement of the intra-ship and inter-ship electromagnetic compatibility EMC, electromagnetic pulse EMP, bonding, and intermodulation interference IMI requirements of MIL-STD-464.

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MIL-STD-1310H(NAVY) APPENDIX B


b.    Before use, an insulation resistance test shall determine:

(1)   1 megohm (minimum) resistance between the conductive case and each active power conductor prong. (2)   0.1 ohm (maximum) resistance between the conductive case and the power cord ground prong.


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